Motion Vector Based Overlay Metrology Algorithm for Wafer Alignment
KIPS Transactions on Software and Data Engineering, Vol. 12, No. 3, pp. 141-148, Mar. 2023
https://doi.org/10.3745/KTSDE.2023.12.3.141, PDF Download:
Keywords: Overlays, Image-Based Overlays, Overlay Targets, Semiconductors, Overlay Metrology Algorithms, motion vectors
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Cite this article
[IEEE Style]
L. H. Chul and W. H. Sung, "Motion Vector Based Overlay Metrology Algorithm for Wafer Alignment," KIPS Transactions on Software and Data Engineering, vol. 12, no. 3, pp. 141-148, 2023. DOI: https://doi.org/10.3745/KTSDE.2023.12.3.141.
[ACM Style]
Lee Hyun Chul and Woo Ho Sung. 2023. Motion Vector Based Overlay Metrology Algorithm for Wafer Alignment. KIPS Transactions on Software and Data Engineering, 12, 3, (2023), 141-148. DOI: https://doi.org/10.3745/KTSDE.2023.12.3.141.