Fault-Causing Process and Equipment Analysis of PCB Manufacturing Lines Using Data Mining Techniques


KIPS Transactions on Software and Data Engineering, Vol. 4, No. 2, pp. 65-70, Feb. 2015
10.3745/KTSDE.2015.4.2.65,   PDF Download:

Abstract

In the PCB(Printed Circuit Board) manufacturing industry, the yield is an important management factor because it affects the product cost and quality significantly. In real situation, it is very hard to ensure a high yield in a manufacturing shop because products called chips are made through hundreds of nano-scale manufacturing processes. Therefore, in order to improve the yield, it is necessary to analyze main fault process and equipment that cause low PCB yield. This paper proposes a systematic approach to discover fault-causing processes and equipment by using a logistic regression and a stepwise variable selection procedure. We tested our approach with lot trace records of real work-site. A lot trace record consists of the equipment sequence that the lot passed through and the number of faults for each fault type in the lot. We demonstrated that the test results reflected the real situation of a PCB manufacturing line.


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Cite this article
[IEEE Style]
H. S. Sim and C. O. Kim, "Fault-Causing Process and Equipment Analysis of PCB Manufacturing Lines Using Data Mining Techniques," KIPS Transactions on Software and Data Engineering, vol. 4, no. 2, pp. 65-70, 2015. DOI: 10.3745/KTSDE.2015.4.2.65.

[ACM Style]
Hyun Sik Sim and Chang Ouk Kim. 2015. Fault-Causing Process and Equipment Analysis of PCB Manufacturing Lines Using Data Mining Techniques. KIPS Transactions on Software and Data Engineering, 4, 2, (2015), 65-70. DOI: 10.3745/KTSDE.2015.4.2.65.